At Bare Board Group, the need of each individual customer is important to us. We strive to provide our clientele with an expanded catalog of manufacturing capabilities in order to fit the wide variety of quality printed circuit boards (PCBs) they require. Below you will find a listing of Bare Board Group's standard manufacturing capabilities. If you require something that is not listed, please contact BBG to give us the opportunity to accommodate YOUR individual need.

Bare Board Group offers an industry leading expansive technology offering including but not limited to:

• Layer Count:  1 – 50 Layers • Rigid, Rigid Flex, Metal Clad and Flex Circuits
• Laser Drill
• Conductive/Non-Conductive via fill
• Blind and Buried vias  • Buried Resistance and Capacitance
• Controlled Impedance • Copper thickness up to 16 oz.
• Hi Temperature Materials • LDI – Laser Direct Imaging
• HASL, Lead Free HASL • Other RoHS finishes
• UL, ISO 9001, and TS 16949 Registered • JCP and ITAR Registered